Description

The U6000 ultrasonic cleaning machine is specifically engineered to efficiently remove solder paste and flux used in leadframe clip bonding for products like DFN and SOP/T. This machine ensures that the surfaces of both the product’s frame and chip are free from volatile residues, hidden cracks, or any other quality concerns. The ultrasonic cleaning process is gentle yet thorough, ensuring that it does not compromise the wire bonding or the adhesion of the encapsulation material.

By using advanced ultrasonic technology, the U6000 maintains the integrity of your products, delivering pristine cleanliness without causing any damage. This makes it an essential tool for maintaining high-quality standards in electronic manufacturing.

You may also want to check out our other advanced cleaning machine: S5000S